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Silicon Strategies, an EE Times Community, is the leading news and analysis resource for semiconductor professionals. Silicon Strategies gives industry and investment professionals the most comprehensive coverage of semiconductor manufacturing and industry worldwide. Your feedback is welcome.

  Headlines for Friday Jan 9, 2009
Is time running out on Spansion?

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Friday's other top stories
  • Lip-Bu Tan named Cadence CEO 
  • Crisis pushes TEL's orders to 7-year low 
  • ASMI cutting 200 jobs in Netherlands as work moves to Singapore 

    News from CES
  • Palm debuts smartphone, operating system 
  • AMD rolls graphics for notebooks 
  • Imagination extends PowerVR, Ensigma IP core ranges 
  • Qualcomm demo's Android running on Snapdragon 
  • Medical technologists at CES: 'Your lungs are calling!' 
  • Conference coverage: 2009 Consumer Electronics Show 
  • Creative Tech forms ZiiLabs to exploit 'stemcell computing' SoC 

    Business news
  • Top 20 predictions for semis in 2009 
  • Spirit DSP, RMI team up for portable attack 
  • Firm downgrades AMAT, ASML, KLA, MEMC, Teradyne 


      Headlines for Thursday Jan 8, 2009
    Analysis: Did Intel underestimate netbook success?

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    Thursday's other top stories
  • Inventory hangover likely in '09, analyst warns  
  • Electronic systems to decline 2% in '09, says report 
  • Goodies for high-tech in Obama $700B recovery plan 

    News from CES
  • Video: LG's Woo Paik on 3DTV 
  • Silicon Image rolls home net technology 
  • AMD debuts 45nm desktop CPUs at CES 
  • Marvell pictures GHz ARM in photo frames 
  • LG and Panasonic pursue divergent 3-D paths 
  • Broadcom demos AMP version Bluetooth at CES 
  • Comment: CES Presents 'The Giant Horny Gorilla from the 3-D Lagoon' 

    Business News
  • TSMC faces record lows in fab utilization 
  • On Semi cuts 1,500 jobs, slashes capex  
  • Fab-tool, materials sector off to rough start 
  • Asyst cuts 15% of workforce, buys out JV 
  • DRAM revenue fell 20% in '08, says iSuppli  
  • ARC sees slightly higher revenues for 2008  
  • Lenovo warns of loss; cuts jobs, restructures 
  • Japan's TDK expects biggest-ever net loss  
  • What will be your engineering legacy? 
  • Blaze DFM lives? Firm said to be involved in merger 

    Technology news
  • Viewpoint: Don't ban benchmarks 


      Headlines for Wednesday Jan 7, 2009
    Microchip slashes forecast, takes pay cuts

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    Wednesday's other top stories
  • Intel says Q4 sales tumbled 23% 
  • EC antitrust raid targets Infineon, NXP, STM 
  • DSP shipments collapse, but wireless holds up 

    News from CES
  • Webcam now goes 3-D 
  • Mitsubishi, Nvidia team up in 3DTV 
  • Toshiba forgoes 3-D, opting for Cell TV in 2009 
  • Intel makes Wi-Fi personal at CES 
  • HDMI gears up for home network role 
  • Asus reads beyond netbook at CES  
  • Europeans plan major assault on CES  
  • Verizon Wireless to support Kindle rivals 
  • SanDisk unveils memory card-based iPod competitor 
  • Monster and Gennum enable longer distance HDMI cables  

    Business news
  • Analyst sees minimal EDA growth in '09  
  • Obama tech appointments seen coming soon 
  • Battery startup recruits 'lab-to-fab' CTO 
  • Americas actual chip sales fell 24% in November, says WSTS 

    Manufacturing news
  • Electrostatic chuck could solve EUV mask problem 

    Product news
  • Portland deploys mobile WiMax 
  • Apache rolls next-gen dynamic power integrity tool  


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      Around Silicon Strategies

    Challenges for 22-nm node: A team of expert analysts from Semiconductor Insights--Xu Chang, Vu Ho, Ramesh Kuchibhatla and Don Scansen--came up with a list of top challenges for the 22-nm node. Here's a list of 15 challenges (and more). More...

    10 fab technologies on the hot seat: There's trouble brewing in chip-making paradise. Delivery of chips at 32-nm and beyond won't be a cool breeze. EE Times has constructed the following list of 10 fab technologies that could make or break future IC scaling. More...

    6 fab technologies on the bubble: It isn't going to be a slam-dunk to deliver chips at 32-nm and beyond. See our story about 10 fab technologies on the hot seat. Then read this article: 6 technologies on the bubble. More...

    Top 20 chip suppliers: Six of the top 10 IC companies are expected to suffer revenue declines in 2008, with the broader industry hamstrung by a ''disastrous'' year for the memory chip segment, according to iSuppli's preliminary rankings of the top 20 chip suppliers. More...

    We want change!: More calls for a change in engineering education surfaced at the recent International Electron Devices Meeting (IEDM). Change is needed to become more competitive. Also see the stream of letters on the subject. More...

    Hot technologies to watch for in 2009: Every technologist, marketer, industry analyst and reporter on a hunt for the next big thing is bracing for the 2009 Consumer Electronics Show scheduled less than a month away. More...

    Top 20 predictions for semis in 2009: To help sort out the confusion in the market, EE Times has released its own chip forecasts--and other predictions--for 2009. So, what will happen in analog, FPGAs, foundry, memory, MPUs and other sectors? More...

    Silicon 60 version 7.0 The EE Times 60 Emerging Startups list, first published in April 2004, has been updated to version 7.0 to reflect the latest corporate, commercial, technology and market conditions. More...

     

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